Imaging apparatus and camera system with optical member

ABSTRACT

An imaging apparatus that forms an image of a light beam transmitted through an imaging lens on an imaging element includes a laminated material that is provided on the imaging element, the light beam being transmitted through the laminated material, the laminated material being provided at a position at which an end portion of an upper surface of the laminated material allows an outermost light beam out of light beams to be transmitted therethrough, the light beams entering a pixel in an outer end portion of the imaging element in an effective pixel area, the position having a width Hopt.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 15/837,622, filed Dec. 11, 2017, which is a continuation ofU.S. patent application Ser. No. 15/647,126, filed Jul. 11, 2017, nowU.S. Pat. No. 9,888,193, which is a continuation of U.S. patentapplication Ser. No. 15/233,273, filed Aug. 10, 2016, now U.S. Pat. No.9,736,407, which is a continuation of U.S. patent application Ser. No.15/045,019, filed Feb. 16, 2016, now U.S. Pat. No. 9,432,598, which is acontinuation of U.S. patent application Ser. No. 14/315,967, filed Jun.26, 2014, now U.S. Pat. No. 9,294,697, which claims the benefit ofJapanese Priority Patent Application JP 2013-143566, filed Jul. 9, 2013,the entire contents of which are each incorporated herein by reference.

BACKGROUND

The present disclosure relates to an imaging apparatus and a camerasystem, and more particularly to an imaging apparatus and a camerasystem that are capable of sufficiently exerting the function of anoptical filter while reducing noise light such as flare and ghost.

An advanced process is introduced into an image sensor in a solid-stateimaging apparatus as in other semiconductor chips. Thus, the size ofchips has been decreasing in recent years. In response to this, when asolid-state imaging apparatus in which an image sensor and a substrateare connected by wire bonding is designed, for example, it isconceivable to design that a bonding pad is arranged in the effectivediameter of a lens in the image sensor.

In such a case, however, light that has entered from the lens isreflected on the surface of a wire (gold wire) connected to the bondingpad and enters a light-receiving surface of the image sensor. As aresult, flare or ghost may be caused.

In view of this, proposed is a solid-state imaging apparatus in which alight blocking member that blocks a light beam of light from the lens,which has entered in the vicinity of the bonding pad arranged on theimage sensor, is provided (see Japanese Patent Application Laid-open No.2006-222249).

Accordingly, it is possible to reduce flare and ghost caused due to thelight that has entered from the lens and is reflected on the surface ofthe gold wire that is connected to the bonding pad to enter thelight-receiving surface of the image sensor.

However, incident light may be reflected also on the edge portion of anopening in the light blocking member. As a result, flare or ghost may becaused.

In view of the above, proposed is a technique in which flare or ghostcaused due to the reflected light on the edge portion of the opening inthe light blocking member is reduced by making the angle of the edgesurface of the opening with respect to an optical axis direction of theincident light larger than the incidence angle of the light that hasentered the edge portion of the light blocking member (see JapanesePatent Application Laid-open No. 2012-186434).

SUMMARY

Now, with reference to the top portion of FIG. 1, the cross-sectionalconfiguration of an existing solid-state imaging apparatus will bedescribed. An object exists in a direction of the upper side of FIG. 1.Incident light from the direction in which the object exists passesthrough an ICRF (Infrared Ray Cut Filter) 11, and is received by animaging device 22 via a laminated material (optical filter) 21. Theimaging device 22 is provided on a substrate 23 and includes a CMOS(Complementary Metal Oxide Semiconductor), for example. The imagingdevice 22 photoelectrically converts incident light into a pixel signaland outputs the pixel signal from a wiring 26 to a signal processingunit (not shown) via a pad portion 25 connected to a wiring layer 24formed on the imaging device 22.

Moreover, to the ICRF 11, a light blocking portion 12 is provided.Incident light is reflected on the wiring 26, and thus noise light suchas flare or ghost caused due to light received by the imaging device 22is reduced. Moreover, as shown in the top portion of FIG. 1, the edgesurface of an opening of the light blocking portion 12 is arranged at apredetermined angle with the light-receiving surface of the imagingdevice 22 in a vertical direction. Accordingly, noise light such asflare and ghost caused due to light reflected on the edge surface of theopening of the light blocking portion 12 is reduced.

Incidentally, as shown in the top portion of FIG. 1, if the laminatedmaterial 21 is arranged so that the end portion thereof corresponds toan end portion of the imaging device 22 and a side wall of the laminatedmaterial 21, which is an end surface, is formed to be perpendicular toan outer end portion of the imaging device 22 in the effective pixelarea, incident light such as light beams L1 and L2 out of light beamsthat have entered the laminated material 21 passes through the laminatedmaterial (optical filter) 21, is processed by the optical filter, and isreceived by the imaging device 22.

However, a light beam L3 shown in the top portion of FIG. 1 passesthrough only a part of the laminated material 21. Therefore, the lightbeam L3 is not sufficiently subject to the filtering effect of theoptical filter, and is received by the imaging device 22. As a result,it may be impossible to sufficiently exert the function of the opticalfilter 21.

In view of the above, as shown in the center of FIG. 1, it isconceivable to provide a laminated material (optical filter) 31 insteadof the laminated material (optical filter) 21 to sufficiently exert thefunction of the optical filter 31 with respect also to the light beamL3. An end portion of the optical filter 31 is protruded toward theoutside of the imaging device 22 in the effective pixel area so that theside surface cross-section thereof is formed in a trapezoidal shape.

In this case, however, since the end portion of the laminated material(optical filter) 31 is protruded compared with the outer end portion ofthe imaging device 22 in the effective pixel area, the position of thepad portion 25 is away from the outer end portion of the imaging device22 in the effective pixel area. Therefore, the size of the substrate 23needs to be increased. As a result, the size of chips in the imagesensor may be increased.

In view of the above, as shown in the bottom of FIG. 1, it isconceivable to provide a laminated material (optical filter) 41 suchthat the end portion of the laminated material (optical filter) 31 isclose to the end portion of the imaging device 22.

Also in this case, however, as shown in the bottom of FIG. 1, becausethe light beams L2 and L3 are not sufficiently transmitted through thelaminated material (optical filter) 41, it may be impossible tosufficiently exert the function of the optical filter.

The present disclosure has been made in view of the above circumstances,and thus there is a need to enable an imaging element to receive a lightbeam, which sufficiently exerts the function of an optical filter whilereducing noise light such as flare and ghost, particularly.

According to an embodiment of the present disclosure, there is providedan imaging apparatus that forms an image of a light beam transmittedthrough an imaging lens on an imaging element, including a laminatedmaterial that is provided on the imaging element, the light beam beingtransmitted through the laminated material, the laminated material beingprovided at a position at which an end portion of an upper surface ofthe laminated material allows an outermost light beam out of light beamsto be transmitted therethrough, the light beams entering a pixel in anouter end portion of the imaging element in an effective pixel area, theposition having a width Hopt.

The width Hopt of the laminated material that allows the outermost lightbeam to be transmitted therethrough may be represented based on athickness of the laminated material, a focal length of a lens, anF-number of the lens, and an image height of an image sensor, by thefollowing formula: Hopt=T*(f−2*H*Fno)/(2*f*Fno+H) in which T, f, Fno,and H represent the thickness of the laminated material, the focallength of the lens, the F-number of the lens, and the image height ofthe image sensor, respectively.

Based on, in addition to the thickness of the laminated material, thefocal length of the lens, the F-number of the lens, and the image heightof the image sensor, a refractive index in an area adjacent to an upperside of the laminated material, a refractive index of the laminatedmaterial, and a one side angle of incident light beams, the width Hoptmay be represented by the following formula: Hopt=T*√{(n2−n*n′sin(θFno))/(n′2−n*n′ sin(θFno))}*(f−2*H*Fno)/(2*f*Fno+H) in which n, n′,and θFno represent a refractive index in an area adjacent to an upperside of the laminated material, a refractive index of the laminatedmaterial, and a one side angle of incident light beams having anF-number of Fno.

The laminated material may have a side wall inclined angle θtilt, andthe side wall inclined angle θtilt may satisfy the following formula:n′*sin(θE)−(2*n)/n″*sin 2(θA)−n*sin(θA)*sin(θE)<1 in which θA and θErepresent an incident angle on the laminated material and 90-θtilt,respectively.

A position of an end portion of a lower surface of the laminatedmaterial may be located on a side of the effective pixel area nearerthan a position of the end portion of the upper surface thereof.

The upper surface of the laminated material may have a width larger thanone of a width obtained by adding the effective pixel area, the widthHopt, and a lithography tolerance and a width obtained by adding theeffective pixel area, the width Hopt, the lithography tolerance, andbonding accuracy of the laminated material.

The laminated material may be in contact with the imaging element via anadhesive layer having a width larger than one of the width obtained byadding the effective pixel area, the lithography tolerance, and thebonding accuracy of the laminated material and a width of a lowersurface of the laminated material, whichever is larger.

The laminated material may be an optical filter.

According to an embodiment of the present disclosure, there is provideda camera system including an imaging apparatus that forms an image of alight beam transmitted through an imaging lens on an imaging element,the imaging apparatus including a laminated material that is provided onthe imaging element, the light beam being transmitted through thelaminated material, the laminated material being provided at a positionat which an end portion of an upper surface of the laminated materialallows an outermost light beam out of light beams to be transmittedtherethrough, the light beams entering a pixel in an outer end portionof the imaging element in an effective pixel area, the position having awidth Hopt.

The width Hopt of the laminated material that allows the outermost lightbeam to be transmitted therethrough may be represented based on athickness of the laminated material, a focal length of a lens, anF-number of the lens, and an image height of an image sensor, by thefollowing formula: Hopt=T*(f−2*H*Fno)/(2*f*Fno+H) in which T, f, Fno,and H represent the thickness of the laminated material, the focallength of the lens, the F-number of the lens, and the image height ofthe image sensor, respectively.

A position of an end portion of a lower surface of the laminatedmaterial may be located on a side of the effective pixel area nearerthan a position of the end portion of the upper surface thereof.

The laminated material may be an optical filter.

According to an embodiment of the present disclosure, there is providedan imaging apparatus that forms an image of a light beam transmittedthrough an imaging lens on an imaging element, including a laminatedmaterial that is provided on the imaging element, the light beam beingtransmitted through the laminated material, the laminated material beingprovided at a position at which an end portion of an upper surface ofthe laminated material allows an outermost light beam out of light beamsto be transmitted therethrough, the light beams entering a pixel in anouter end portion of the imaging element in an effective pixel area, theposition having a width Hopt.

According to an embodiment of the present disclosure, it is possible tosufficiently exert the function of an optical filter while reducingnoise light such as flare and ghost.

These and other objects, features and advantages of the presentdisclosure will become more apparent in light of the following detaileddescription of best mode embodiments thereof, as illustrated in theaccompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram showing a configuration example of an existingimaging apparatus;

FIG. 2 is a diagram showing a configuration example of an imagingapparatus according to an embodiment of the present disclosure;

FIG. 3 is a diagram for explaining an optically necessary width(protruding amount);

FIG. 4 is a diagram for explaining an optically-necessary width takinginto account the refraction;

FIG. 5 is a diagram for explaining a laminated material in areverse-tapered shape;

FIG. 6 is a diagram for explaining a laminated material in a taperedshape;

FIG. 7 is a diagram for explaining a configuration example in the casewhere an optically-necessary width and a lithography tolerance are takeninto account;

FIG. 8 is a diagram for explaining a configuration example in the casewhere an optically-necessary width, a lithography tolerance, and bondingaccuracy are taken in to account;

FIG. 9 is a diagram for explaining a configuration example in the casewhere an optically-necessary width, a lithography tolerance, bondingaccuracy, and an adhesive layer are taken into account;

FIG. 10 is a diagram for explaining a configuration example in the casewhere an optically-necessary width, a lithography tolerance, bondingaccuracy, and an adhesive layer in a laminated material in areverse-tapered shape are taken into account;

FIG. 11 is a diagram for explaining the relationship between an F-numberand an optically-necessary width (protruding amount);

FIG. 12 is a diagram for explaining the principle of noise caused due tototal reflection;

FIG. 13 is a diagram for explaining the relationship between the angleof a side wall and an incidence angle; and

FIG. 14 is a diagram for explaining the conditions of the totalreflection of light on the side wall.

DETAILED DESCRIPTION OF EMBODIMENTS

Hereinafter, embodiments of the present disclosure will be describedwith reference to the drawings. It should be noted that the descriptionwill be given in the following order.

1. First embodiment (example in which an optically-necessary width isset in a laminated material)

2. Second embodiment (example in which an optically-necessary width isset by providing a reverse-tapered portion, i.e., making the upper sideof a laminated material large)

3. Third Embodiment (example in which an optically-necessary width isset by providing a tapered portion, i.e., making the upper side of alaminated material small)

4. Fourth Embodiment (example in which an optically-necessary width anda lithography tolerance are taken into account)

5. Fifth Embodiment (example in which an optically-necessary width, alithography tolerance, and bonding accuracy are taken into account)

6. Sixth Embodiment (example in which an optically-necessary width, alithography tolerance, bonding accuracy, and an adhesive layer are takeninto account)

7. Seventh Embodiment (example in which an optically-necessary width, alithography tolerance, bonding accuracy, and an adhesive layer in alaminated body in a reverse-tapered shape are taken into account)

1. First Embodiment

The top and bottom of FIG. 2 each show a configuration example of a sidesurface cross-section in the vicinity of an imaging device in an imagingapparatus (camera or camera system). On a substrate 103 including aresin material, an imaging device 102 including a CMOS (ComplementaryMetal Oxide Semiconductor), a CCD (Charged Coupled Device), or the likeis formed. On the imaging device 102, a wiring layer 104 that transfersa pixel signal is formed. On the upper portion of the wiring layer 104,a laminated material 101 including an optical filter is laminated. Onthe wiring layer 104, a pad portion 105 electrically connected to awiring 106 is provided. The pixel signal generated by the imaging device102 is transferred through the wiring 106.

Incident light that is emitted from above the upper side of FIG. 2 onwhich a subject exists and is transmitted through a lens 100 istransmitted through the laminated material 101 formed of an opticalfilter, is optically processed by the optical filter, and then entersthe imaging device 102. By photoelectrically converting the incidentlight, the imaging device 102 generates a pixel signal formed of anelectric signal and outputs, via the wiring layer 104, the pixel signalthrough the wiring 106 connected to the pad portion 105.

It should be noted that as shown in the top of FIG. 2, when incidentlight beams L11 to L13 out of light beams that have entered thelaminated material 101 enter the end portion of the laminated material101 and an outer end portion of the imaging device 102 in the effectivepixel area, the incident light beams L11 and L12 are transmitted throughthe laminated material 101 from the upper surface of FIG. 2 to the lowersurface of FIG. 2. Therefore, the incident light beams L11 and L12 aresufficiently processed by the optical filter and then enter the imagingdevice 102. However, the incident light beam L13 enters the laminatedmaterial 101 from a side wall of thereof, is transmitted through only apart of the laminated material 101, and then enters the imaging device102. In this case, since the incident light beam L13 is transmittedthrough only a part of the laminated material 101, the incident lightbeam L13 is not sufficiently processed by the optical filter and thenenters the imaging device 102. As a result, in the vicinity of the endportion of the imaging device 102, a pixel signal is generated byincident light that has not sufficiently processed by the opticalfilter. Therefore, a signal that is optically degraded as compared witha pixel signal in other areas may be generated.

As shown in the lower portion of FIG. 2, in order to prevent a pixelsignal from being degraded due to light that is not sufficientlyprocessed by the optical filter as described above, there is a need toprovide the laminated material 101 having a large size such that thelaminated material 101 protrudes as compared with the imaging device 102so as not to interfere with the pad portion 105. With such aconfiguration, as shown in the lower portion of FIG. 2, since the endportion of the laminated material 101 protrudes as compared with theimaging device 102 in the effective pixel area, it is possible to causeany one of the incident light beams L11 to L13 that has entered theouter end portion of the imaging device 102 in the effective pixel areato be transmitted through the laminated material 101 from the uppersurface to the lower surface thereof. Therefore, it is possible tosufficiently exert the function of the laminated material 101 as anoptical filter.

In the following description, a length (protruding amount) in which thelaminated material 101 protrudes from the end portion of the imagingdevice 102 at the end portion of the laminated material 101 is referredto also as “optically-necessary width Hopt,” and is described as “Hopt”as shown in the lower portion of FIG. 1. The same shall apply to theother figures.

(Setting of Optically-Necessary Width)

The optically-necessary width Hopt needs to be set to a length in whichthe laminated material 101 does not interfere with the pad portion 105and the entire size of the chip configuration is not too largeunnecessarily. More specifically, the optically-necessary width Hopt isset such that an outermost light beam out of light beams that haveentered the imaging device 102 from the lens 100, which form an image onthe imaging device 102 and enter a pixel that performs photoelectricconversion on light at the outermost periphery of the imaging device 102in the effective pixel area is transmitted through the end portion ofthe upper surface of the laminated material (optical filter or the like)101 that is in contact with the imaging device 102.

Now, a specific method of setting the optically-necessary width Hoptwill be described.

An F-number Fno of the lens 100 through which incident light that enterthe imaging device 102 via the laminated material 101 is transmittedwill be described first. The F-number Fno is represented by thefollowing equation (1). Specifically, as shown in the left portion ofFIG. 3, the F-number Fno is a value obtained by dividing a focal lengthf of a lens D by an effective diameter D.

$\begin{matrix}{F_{no} = \frac{f}{D}} & (1)\end{matrix}$

At this time, as shown in the left portion of FIG. 3, when an anglebetween a straight line extending from an end portion of the effectivediameter to the focal position and the optical axis (one side angle oflight beams having the F-number) is an angle θFno, tan(θFno) isrepresented by the following equation (2).

$\begin{matrix}{\frac{\frac{1}{2}D}{f} = {\tan\;\theta_{Fno}}} & (2)\end{matrix}$

Based on these conditions, the optically-necessary width Hopt is set asshown in the right portion of FIG. 3. It should be noted that in theright portion of FIG. 3, H represents the image height in the focallength of the lens 100, and T represents the thickness of the laminatedmaterial 101 formed of an optical filter. Moreover, θfH is an anglebetween a light beam direction of one side angle θFno of light beamshaving the F-number with respect to an outermost light beam of lightbeams that enter a pixel that performs photoelectric conversion on lightat the outermost periphery of the imaging device 102 and an optical axisdirection. Therefore, tan(θfH) is represented by the following equation(3).

$\begin{matrix}{{\tan\mspace{14mu}\theta_{fH}} = \frac{H}{f}} & (3)\end{matrix}$

Moreover, when the equation (2) is modified, tan(θFno) is represented bythe following equation (4).

$\begin{matrix}{{\tan\mspace{14mu}\theta_{Fno}} = \frac{1}{2F_{no}}} & (4)\end{matrix}$

Furthermore, as shown in the right portion of FIG. 3, theoptically-necessary width Hopt is represented by the following equation(5).if θ_(Fno)>θ_(fH)tan(θ_(Fno)−θ_(fH))×T=H _(opt)  (5)

Here, when the equation (3) and the equation (4) are applied totan(θFno) and tan(θfH) in the equation (5), the optically-necessarywidth Hopt is obtained as shown in the following equation (6).

$\begin{matrix}\begin{matrix}{H_{opt} = {T \times \frac{{\tan\mspace{11mu}\theta_{Fno}} - {\tan\mspace{11mu}\theta_{fH}}}{1 + {\tan\mspace{11mu}\theta_{Fno} \times \tan\mspace{11mu}\theta_{fH}}}}} \\{= {T \times \frac{\frac{1}{2F_{no}} - \frac{H}{f}}{1 + {\frac{1}{2F_{no}} \times \frac{H}{f}}}}} \\{= {T \times \frac{\frac{f - {2F_{no}H}}{2F_{no}f}}{1 + \frac{H}{2F_{no}f}}}} \\{= {T \times \frac{f - {2F_{no}H}}{{2F_{no}f} + H}}}\end{matrix} & (6)\end{matrix}$

As described above, it is possible to set the optically-necessary widthHopt to an appropriate value with the thickness T of the laminatedmaterial 101 formed of an optical filter, the focal length f of the lens100, the F-number Fno, and the image height H.

Moreover, as shown in the equation (6), the optically-necessary widthHopt takes the maximum value when the focal length f is infinite or in atelecentric optical system, and is set as shown in the followingequation (7).

$\begin{matrix}{H_{opt} = {{T \times \tan\mspace{11mu}\theta_{Fno}} = {T \times \frac{1}{2F_{no}}}}} & (7)\end{matrix}$

It should be noted that the optically-necessary width Hopt set by theequations (6) and (7) takes a simplified value in the case where theoptical filter of the laminated material 101 has a refractive index of1.

In view of the above, by setting a thickness t′ of the laminatedmaterial 101 taking into account of a refractive index instead of thethickness T of the laminated material 101 with no consideration of arefractive index, it is possible to set the optically-necessary widthHopt to a value taking into account a refractive index as shown in thefollowing equation (8).

$\begin{matrix}{H_{opt} = {t \times \frac{f - {2F_{no}H}}{{2F_{no}\mspace{11mu} f} + H}}} & (8)\end{matrix}$

Here, t represents a thickness at which incident light arrives in thelaminated material 101 with no consideration of a refractive index atthe same incident position as that of the thickness t′ taking intoaccount a refractive index, and represents a thickness in the sameposition in the horizontal direction when the incident light arrives ata lower surface of the laminated material 101 taking into account arefractive index. More specifically, the thickness t can be described asbelow.

Specifically, as shown in FIG. 4, a refractive index in upper space ofthe laminated material 101 is assumed to be n and a refractive index inspace in the laminated material 101 is assumed to be n′. Withrefraction, the one side angle θFno of light beams having the F-numberof upper space of the laminated material 101 takes an angle θ′Fno in thelaminated material 101. Here, a position of the lower surface of thelaminated material 101 at which light that has entered the boundary ofthe upper surface of the laminated material 101 from the area above thelaminated material 101 arrives with the optical axis of the laminatedmaterial 101 by refraction is assumed to be an optical axis, a distancefrom the position of the incident light on the upper surface to theoptical axis is a distance p, and a distance in the optical axisdirection from the upper surface of the laminated material 101 to anintersection point between the optical axis and light that has beentransmitted without refraction at the incident position is a distance t,which is the thickness t. In addition, at this time, a thickness of thelaminated material 101 taking into account a refractive index is thethickness t′.

It should be noted that based on the law of refraction (Snell's law),the following equation (9) is established.n sin θ_(Fno) =n′ sin θ′_(Fno)  (9)

Moreover, based on the relationships between the distances p, t, and t′and the angles θFno and θ′Fno, the following equations (10) and (11) areestablished.P=t tan θ_(Fno)  (10)P=t′ tan θ′_(Fno)  (11)

Furthermore, based on the relationship between the equation (10) and theequation (11), the following equation (12) is established.t tan θ_(Fno) =t′ tan θ′_(Fno)  (12)

Here, the equation (9) is modified to obtain x represented by thefollowing equation (13). In this case, tan (θ′Fno) is represented by thefollowing equation (14).

$\begin{matrix}{{\sin\mspace{11mu}\theta_{Fno}^{\prime}} = {{\frac{n}{n^{\prime}}\mspace{14mu}\sin\mspace{11mu}\theta_{Fno}} = x}} & (13) \\{{\tan\mspace{11mu}\theta_{Fno}^{\prime}} = {\pm \frac{x}{\sqrt{1 - x^{2}}}}} & (14)\end{matrix}$

Moreover, the equation (9) is modified to obtain y represented by thefollowing equation (15). In this case, tan (θFno) is represented by thefollowing equation (16).

$\begin{matrix}{{\sin\mspace{11mu}\theta_{Fno}^{\prime}} = {{\frac{n^{\prime}}{n}\mspace{14mu}\sin\mspace{11mu}\theta_{Fno}} = {{\frac{n^{\prime}}{n}x} = y}}} & (15) \\{{\tan\mspace{11mu}\theta_{Fno}^{\prime}} = {\pm \frac{y}{\sqrt{1 - y^{2}}}}} & (16)\end{matrix}$

When the equation (14) and the equation (16) are applied to the equation(12), the following equation (17) is established.

$\begin{matrix}{{t \times \left( {\pm \frac{y}{\sqrt{1 - y^{2}}}} \right)} = {t^{\prime} \times \left( {\pm \frac{x}{\sqrt{1 - x^{2}}}} \right)}} & (17)\end{matrix}$

It should be noted that the left side can be modified to the followingequation (18).

$\begin{matrix}{{{Left}\mspace{14mu}{side}} = {{t \times \left( {\pm \frac{\frac{n^{\prime}}{n}x}{\sqrt{1 - {\frac{n^{\prime 2}}{n^{\prime}}x^{2}}}}} \right)} = {t \times \left( {\pm \frac{n^{\prime}x}{\sqrt{n^{2} - {n^{\prime 2}x^{2}}}}} \right)}}} & (18)\end{matrix}$

Furthermore, when the modified left side represented by the equation(18) is applied to the equation (17), the following equation (19) isestablished.

$\begin{matrix}{{{\pm t} \times \frac{n^{\prime}x}{\sqrt{n^{2} - {n^{\prime 2}x^{2}}}}} = {{\pm t^{\prime}} \times \left( \frac{x}{\sqrt{1 - x^{2}}} \right)}} & (19)\end{matrix}$

It should be noted that when the equation (1) is solved for acoefficient t, the following equation (20) is established.

$\begin{matrix}\begin{matrix}{t = {t^{\prime} \times \sqrt{\frac{\frac{n^{2}}{n^{\prime 2}} - {\frac{n}{n^{\prime}}\mspace{11mu}\sin\mspace{11mu}\theta_{Fno}}}{1 - {\frac{n}{n^{\prime}}\mspace{11mu}\sin\mspace{11mu}\theta_{Fno}}}}}} \\{= {t^{\prime} \times \sqrt{\frac{n^{2} - {n\mspace{11mu} n^{\prime}\mspace{11mu}\sin\mspace{11mu}\theta_{Fno}}}{n^{\prime 2} - {n\mspace{11mu} n^{\prime}\mspace{11mu}\sin\mspace{11mu}\theta_{Fno}}}}}}\end{matrix} & (20)\end{matrix}$

Here, the refractive index n in upper space of the laminated material101 is assumed to be 1. The coefficient t is represented by thefollowing equation (21).

$\begin{matrix}{t = {t^{\prime} \times \sqrt{\frac{1 - {n^{\prime}\mspace{11mu}\sin\mspace{11mu}\theta_{Fno}}}{n^{\prime 2} - {n^{\prime}\mspace{11mu}\sin\mspace{11mu}\theta_{Fno}}}}}} & (21)\end{matrix}$

As described above, in the case where a refractive index is taken intoaccount, it is possible to set the optically-necessary width Hopt to anappropriate value with the refractive index n in upper space of thelaminated material 101 and the refractive index n′ in space in thelaminated material 101 in addition to the thickness t′ of the laminatedmaterial 101, the focal length f of the lens 100, the F-number Fno, andthe image height H.

By setting the optically-necessary width Hopt as described above, asshown in the lower portion of FIG. 2, the light beam L3, which has adifficulty of being transmitted through the laminated material 101 inthe configuration shown in the upper portion of FIG. 2, in addition tothe light beams L1 and L2, can be transmitted through the laminatedmaterial 101 from the upper surface to the lower surface thereof.Therefore, it is possible to sufficiently exert the function of thelaminated material 101 as an optical filter.

2. Second Embodiment

Incidentally, if the optically-necessary width Hopt is set such that thelight beams L1, L2, and L3 are transmitted through the laminatedmaterial 101 from the upper surface to the lower surface thereof asshown in FIG. 2, because the laminated material 101 is provided in sucha way that the lower surface thereof does not interfere with the padportion 105, the number of image sensors that can be produced from asilicon wafer is decreased.

However, as shown in FIG. 2, in the case where the light beams L1 to L3are transmitted through the laminated material 101 from the uppersurface to the lower surface thereof, the optically-necessary width Hoptneeds to be set for only the upper surface of the laminated material101. The optically-necessary width Hopt does not necessarily need to beset for the lower surface of the laminated material 101.

In view of the above, as shown in FIG. 5, the optically-necessary widthHopt may be set for only the upper surface of the laminated material101, and the lower surface of the laminated material 101 may extendwithin the range from the end portion of the imaging device 102 to aportion at which the laminated material 101 does not interfere with thepad portion 105. In this way, it is possible to make the pad portion 105closer to the imaging device 102. The necessary area of the substrate103 can be reduced, and thus the number of image sensors that can beproduced from a silicon wafer can be increased.

3. Third Embodiment

Moreover, based on the similar reason, the width of the lower surfacemay be larger than the optically-necessary width Hopt as long as theoptically-necessary width Hopt is set for the upper surface of thelaminated material 101. Therefore, as shown in FIG. 6, the lower surfacemay be larger than the upper surface.

It should be noted that when the laminated material 101 is produced,after the laminated material 101 is applied to the imaging device 102 ofa silicon wafer by spin-coating or the like and is cured, there is aneed to remove the laminated material 101 in the case where it isnecessary to provide an opening or the like for the pad portion 105 forenergization on the imaging device 102. As shown in FIG. 6, in the casewhere an unnecessary portion in the laminated material 101 is removedwith a lithography technique and an etching technique in asemiconductor, it is difficult to make the shape of the side surface ofthe laminated material 101 a trapezoidal shape (structure in which theupper surface is narrower than the lower surface). However, as shown inFIG. 5, it is possible to easily make the structure of an invertedtrapezoidal shape (structure in which the upper surface is wider thanthe lower surface). Moreover, the easiness of the formation exerts aninfluence on manufacturing (developing) cost or stability ofmanufacturing variability. Thus, from viewpoints of optical propertiesof the laminated material 101, the number of the laminated material 101that can be produced, and the difficulty of the manufacturing, the shapeof the laminated material 101 is favorably the inverted trapezoidalshape shown in FIG. 5.

4. Fourth Embodiment

In the above description, the example in which the optically-necessarywidth Hopt is set for the upper surface of the laminated material 101has been described. However, for example, for the position at which thelaminated material 101 is set, a lithography (including etching)tolerance may be taken into account. Specifically, as shown in FIG. 7, awidth obtained by adding a lithography tolerance Hlitho to theoptically-necessary width Hopt may be set between the end portion of theimaging device 102 and the pad portion 105 so that the upper surface ofthe laminated material 101 protrudes from the outer end portion of theimaging device 102 in the effective pixel area. Specifically, “theoptically-necessary width Hopt+the lithography tolerance Hlitho” may beset as a width from the outer end portion of the imaging device 102 inthe effective pixel area to the end portion of the upper surface of thelaminated material 101. With such setting, it is possible tosufficiently exert the function of the laminated material 101 as anoptical filter, and to alleviate the lithography (including etching)tolerance.

5. Fifth Embodiment

Moreover, in the case where the laminated material 101 is placed on thesubstrate 103 by being bonded thereto, a bonding accuracy Hmount may befurther added as shown in FIG. 8. Specifically, a width from the outerend portion of the imaging device 102 in the effective area to the endportion of the upper surface of the laminated material 101 may be set to“the optically-necessary width Hopt+the lithography tolerance Hlitho+thebonding accuracy Hmount.” With such setting, it is possible tosufficiently exert the function of the laminated material 101 as anoptical filter, and to alleviate not only the lithography (includingetching) tolerance but also the errors due to the bonding.

6. Sixth Embodiment

Furthermore, in the case where the laminated material 101 is bonded tothe imaging device 102 via an adhesive layer 151, as shown in FIG. 9, bymaking a width Hglue of the adhesive layer 151 larger than “theoptically-necessary width Hopt+the lithography tolerance Hlitho+thebonding accuracy Hmount,” it is possible to sufficiently exert thefunction of the laminated material 101 as an optical filter, and toreliably attach the laminated material 101 on the imaging device 102.

7. Seventh Embodiment

Moreover, even in the case where the shape of the side surfacecross-section of the laminated material 101 is an inverted trapezoidalshape, as shown in FIG. 10, the width Hglue of the adhesive layer 151may be larger than “the optically-necessary width Hopt+the lithographytolerance Hlitho+the bonding accuracy Hmount.” In this way, it ispossible to sufficiently exert the function of the laminated material101 as an optical filter, and to reliably attach the laminated material101 on the imaging device 102.

(F-Number and Optically-Necessary Width (Protruding Amount))

Incidentally, the incidence angle of a principal light beam from thelens 100 to an imaging surface generally is increased as the imageheight H is high. In the case where the incidence angle is larger thanthat of the light beams shown in FIG. 2 (the image height is high or thefocal length is short), the light beams are incident on the left side ascompared with the case of FIG. 2. Therefore, the number of light beamsthat are not transmitted through the laminated material 101 is reduced.

It should be noted that the left portion of FIG. 11 shows the effectivepixel area of the imaging device 102 viewed from the upper surface, andpoints shown at the center of the upper end and the center of the lowerend of the imaging device 102 represent positions in the side wall ofthe laminated material 101 at which the incidence angle of light beamsis the smallest (the number of light beams that have not beentransmitted through the laminated material 101 is the largest).

The right portion of FIG. 11 is a graph showing the relationship betweenthe F-number Fno (1 to 16) and the optically-necessary width Hopt in thecase where the 35 mm equivalent focal length in the image height H ofthe imaging device 102 shown in the left portion of FIG. 11 using theequation (6) is 12 mm, and the thickness of the laminated material 101is 100 μm.

As shown in the graph of the right portion of FIG. 11, because, in thecase where the F-number Fno is 1 and the 35 mm equivalent focal lengthis 24 mm, the optically-necessary width Hopt is 0 μm, there is a need totake into account the optically-necessary width Hopt+the lithographytolerance Hlitho+the bonding accuracy Hmount if the 35 mm equivalentfocal length of the lens 100 is longer than 24 mm. On the other hand, inthe case where the 35 mm equivalent focal length of the lens 100 isshorter than 24 mm, there is no need of the optically-necessary widthHopt. It only needs to take into account the lithography toleranceHlitho+the bonding accuracy Hmount. It should be noted that in the rightportion of FIG. 11, as shown in the right area thereof, the linesrepresent wavelengths of a telecentric lens and lenses having the 35 mmequivalent focal lengths of 500 mm, 125 mm, 30 mm, 24 mm, and 18 mm fromthe above.

Moreover, in the case of the telecentric lens, the incidence angle ofprincipal light beam is 0 degree (perpendicular) regardless of the focallength and the optically-necessary width Hopt is the largest. In thiscase, the above-mentioned equation (7) is used to calculate theoptically-necessary width Hopt.

(Influence of Tapered Shape)

As shown in FIGS. 5 to 10, the shape of the side surface cross-sectionof the laminated material 101 may be any one of an inverted trapezoidalshape or a trapezoidal shape. In the following description, these shapesare also referred to as a reverse-tapered shape and a tapered shape,respectively.

It should be noted that when a light beam that has entered the uppersurface of the laminated material 101 having a tapered shape or areverse-tapered shape enters the side wall (e.g., position indicated bya point shown in the left portion of FIG. 11), as shown in the leftportion and center portion of FIG. 12, an incident light L101 and anincident light L102 enter the side wall, are refracted on the side wall,are transmitted through the laminated material 101, and go out from thelaminated material 101 in some cases, depending on the incidence angle.On the other hand, as shown in the right portion of FIG. 12, if anincident light L103 is totally reflected and travels in the laminatedmaterial 101, the incident light L103 reaches the effective pixel area,which may exert an influence as noise light such as ghost and flare.

FIG. 13 shows the distribution of the case where light is totallyreflected and the case where light is not totally reflected depending onconditions including the incidence angle from the upper surface of thelaminated material (optical filter or the like) 101 and the inclinedangle of the side wall. It should be noted that in FIG. 13, thehorizontal axis represents an inclined angle with respect to the opticalaxis of the side wall, and the vertical axis represents the incidenceangle. In addition, distribution of the shaded area represents the areain which light is totally reflected and distribution of the gray arearepresents the area in which light is not totally reflected. Here, therefractive index of the laminated material is assumed to be 1.5, and therefractive index of air is assumed to be 1. In this case, the surfacereflectance is about 4%. On the other hand, in the case of the totalreflection, because almost all of the optical energy is stored, totallyreflected light exerts a significant influence as noise light such asghost. Accordingly, it is favorable to slope the side wall under theconditions where light is not totally reflected. Therefore, thedistribution shown in FIG. 13 represents that noise light such as ghostand flare is liable to be reduced with the shape of the laminatedmaterial 101 being a reverse-tapered shape because the area in whichlight is not totally reflected is wide in the case where the shape ofthe laminated material 101 is a reverse-tapered shape as compared withthe case where the shape of the laminated material 101 is a taperedshape.

(Conditions where Light is not Totally Reflected)

Next, with reference to FIG. 14, the conditions in which light is nottotally reflected will be described. It should be noted that FIG. 14shows the conditions where incident light is totally reflected in thevicinity of a side wall W of the laminated material 101 having areverse-tapered shape. Here, the incidence angle of a light beam to thelaminated material 101 is assumed to be an angle θA, the refractionangle of a light beam whose incident angle is the angle θA is assumed tobe a refraction angle θB, angle to be the incident angle of a light beamwhose refraction angle is the refraction angle θB to the side wall W isan angle θC, the inclined angle of the side wall W of the laminatedmaterial 101 with respect to the optical axis is assumed to be aninclined angle θtilt, a refractive index in the laminated material 101is assumed to be refractive index n′, and a refractive index in theoutside of the laminated material 101 is assumed to be the refractiveindex n. Moreover, an angle θE between the upper surface of thelaminated material 101 and the inclining portion of the side wall W isassumed to be 90°-θtilt, and an angle θX between a light beam whoseincidence angle is the angle θC and the inclining portion of the sidewall W is assumed to be 90-θC. At this time, a light beam that hasentered the laminated material 101 is totally reflected on the incliningportion of the side wall, which causes ghost or flare in an image. Inview of the above, in order to reduce the ghost or flare, the conditionswhere the light that has entered the laminated material 101 is nottotally reflected on the inclining portion of the side wall need to besatisfied.

Here, based on the Snell's law, the following equation (22) isestablished from the relationship of FIG. 14.n sin θ_(A) =n′ sin θ_(B)  (22)

Moreover, from FIG. 14, the angles θE, θX, and θB are represented by thefollowing equations (23) to (25), respectively.

$\begin{matrix}{{\theta_{E} + \theta_{x}} = {{90{^\circ}} + \theta_{B}}} & (23) \\{\theta_{x} = {{90{^\circ}} + \theta_{B} - \theta_{E}}} & (24) \\\begin{matrix}{\theta_{C} = {{{90{^\circ}} - \theta_{x}} = {{90{^\circ}} - \left( {{90{^\circ}} + \theta_{B} - \theta_{E}} \right)}}} \\{= {\theta_{E} - \theta_{B}}}\end{matrix} & (25)\end{matrix}$

The conditions where light is totally reflected on the inclining portionof the side wall W are represented by the following equation (26) basedon the Snell's law.n′ sin θ_(c)>1  (26)

Here, when the equation (25) is applied to the equation (26), thefollowing equation (27) is satisfied.n′ sin(θ_(E)−θ_(B))>1  (27)

Furthermore, the equation (27) is developed to the following equation(28) including the incidence angle GA and the angle GE between the uppersurface of the laminated material 101 and the side wall W usingsum-to-product identities of trigonometric functions or the like.

$\begin{matrix}{{{{n^{\prime}\sin\mspace{11mu}\theta_{E}\mspace{14mu}\cos\mspace{11mu}\theta_{B}} - {n^{\prime}\mspace{11mu}\cos\mspace{11mu}\theta_{E}\mspace{11mu}\sin\mspace{11mu}\theta_{B}}} > 1}{{{n^{\prime}\sin\mspace{11mu}\theta_{E}\mspace{14mu}\left( {1 - {2\;\sin\mspace{14mu}\theta_{B}}} \right)} - {n\mspace{11mu}\sin\mspace{11mu}{\theta_{A} \cdot \cos}\mspace{11mu}\theta_{E}}} > 1}{{{n^{\prime}\mspace{11mu}\sin\mspace{11mu}\theta_{E}} - {2n^{\prime}\mspace{11mu}\sin\mspace{11mu}\theta_{B}} - {n\mspace{11mu}\sin\mspace{11mu}{\theta_{A} \cdot \cos}\mspace{11mu}\theta_{E}}} > 1}{{{n^{\prime}\mspace{11mu}\sin\mspace{11mu}\theta_{E}} - {2n^{\prime}\sin\mspace{11mu}{\theta_{B} \cdot \sin}\mspace{11mu}\theta_{C}} - {n\mspace{11mu}\sin\mspace{11mu}{\theta_{A} \cdot \cos}\mspace{11mu}\theta_{E}}} > 1}{{{n^{\prime}\sin\mspace{11mu}\theta_{E}} - {2n\mspace{11mu}\sin\mspace{11mu}{\theta_{A} \cdot \sin}\mspace{11mu}\theta_{B}} - {n\mspace{11mu}\sin\mspace{11mu}{\theta_{A} \cdot \cos}\mspace{11mu}\theta_{E}}} > 1}{{{n^{\prime}\sin\mspace{11mu}\theta_{E}} - {\frac{2n}{n^{\prime}}\mspace{14mu}\sin\mspace{11mu}{\theta_{A} \cdot \sin}\mspace{11mu}\theta_{A}} - {n\mspace{11mu}\sin\mspace{11mu}{\theta_{A} \cdot \cos}\mspace{11mu}\theta_{E}}} > 1}} & (28)\end{matrix}$

The equation (28) is conditions of total reflection. Therefore, thefollowing equation (29) obtained by reversing the inequality sign of theequation (28) is conditions where light is not totally reflected.

$\begin{matrix}{{{{- \frac{2n}{n^{\prime}}}\mspace{11mu}\sin^{2}\mspace{11mu}\theta_{A}} - {n\mspace{11mu}\cos\mspace{11mu}{\theta_{E} \cdot \sin}\mspace{11mu}\theta_{A}} + {n^{\prime}\mspace{11mu}\sin\mspace{11mu}\theta_{E}}} < 1} & (29)\end{matrix}$

Here, the inclined angle θtilt of the side wall can be represented bythe angle θE between the upper surface of the laminated material 101 andthe side wall W, which is represented by the following equation (30).θ_(tilt)=90−θ_(E)  (30)

Therefore, when the equation (29) and the equation (30) are satisfied,it is possible to cause light not to be totally reflected. Therefore, inFIG. 13, the shaded area represents the area in which the equation (29)and the equation (30) are not satisfied, and the gray area representsthe area in which the equation (29) and the equation (30) are satisfied.

Accordingly, when the relationship between the inclined angle of theside wall W of the laminated material 101 and the incidence anglesatisfies the equation (29) and the equation (30), it is possible toreduce noise light such as flare and ghost.

As described above, according to the present disclosure, because lightbeams that have entered the imaging element of the image sensor can betransmitted through the laminated material (optical filter or the like),it is possible to sufficiently exert the desired performance of thelaminated material (optical filter). In addition, by making thelaminated material in a shape that satisfies the conditions where lightis not totally reflected, it is possible to reduce the influence due tonoise light such as flare and ghost.

It should be noted that embodiments of the present disclosure are notlimited to the above-mentioned embodiments and various modifications canbe made without departing from the gist of the present disclosure.

Moreover, the present disclosure may also take the followingconfigurations.

(1) An imaging apparatus that forms an image of a light beam transmittedthrough an imaging lens on an imaging element, including

a laminated material that is provided on the imaging element, the lightbeam being transmitted through the laminated material, the laminatedmaterial being provided at a position at which an end portion of anupper surface of the laminated material allows an outermost light beamout of light beams to be transmitted therethrough, the light beamsentering a pixel in an outer end portion of the imaging element in aneffective pixel area, the position having a width Hopt.

(2) The imaging apparatus according to (1), in which

the width Hopt of the laminated material that allows the outermost lightbeam to be transmitted therethrough is represented based on a thicknessof the laminated material, a focal length of a lens, an F-number of thelens, and an image height of an image sensor, by the following formula:Hopt=T*(f−2*H*Fno)/(2*f*Fno+H)

in which T, f, Fno, and H represent the thickness of the laminatedmaterial, the focal length of the lens, the F-number of the lens, andthe image height of the image sensor, respectively.

(3) The imaging apparatus according to (2), in which

based on, in addition to the thickness of the laminated material, thefocal length of the lens, the F-number of the lens, and the image heightof the image sensor, a refractive index in an area adjacent to an upperside of the laminated material, a refractive index of the laminatedmaterial, and a one side angle of incident light beams, the width Hoptis represented by the following formula:Hopt=T*√{(n2−n*n′ sin(θFno))/(n′2−n*n′sin(θFno))}*(f−2*H*Fno)/(2*f*Fno+H)

in which n, n′, and θFno represent a refractive index in an areaadjacent to an upper side of the laminated material, a refractive indexof the laminated material, and a one side angle of incident light beamshaving an F-number of Fno.

(4) The imaging apparatus according to (3), in which

the laminated material has a side wall inclined angle θtilt, and theside wall inclined angle θtilt satisfies the following formula:n′*sin(θE)−(2*n)/n′*sin 2(θA)−n*sin(θA)*sin(θE)<1

wherein θA and θE represent an incident angle on the laminated materialand 90-θtilt, respectively.

(5) The imaging apparatus according to (1), in which

a position of an end portion of a lower surface of the laminatedmaterial is located on a side of the effective pixel area nearer than aposition of the end portion of the upper surface thereof.

(6) The imaging apparatus according to (2), in which

the upper surface of the laminated material has a width larger than oneof a width obtained by adding the effective pixel area, the width Hopt,and a lithography tolerance and a width obtained by adding the effectivepixel area, the width Hopt, the lithography tolerance, and bondingaccuracy of the laminated material.

(7) The imaging apparatus according to (6), in which

the laminated material is in contact with the imaging element via anadhesive layer having a width larger than one of the width obtained byadding the effective pixel area, the lithography tolerance, and thebonding accuracy of the laminated material and a width of a lowersurface of the laminated material, whichever is larger.

(8) The imaging apparatus according to (1), in which

the laminated material is an optical filter.

(9) A camera system including

an imaging apparatus that forms an image of a light beam transmittedthrough an imaging lens on an imaging element, the imaging apparatusincluding

-   -   a laminated material that is provided on the imaging element,        the light beam being transmitted through the laminated material,        the laminated material being provided at a position at which an        end portion of an upper surface of the laminated material allows        an outermost light beam out of light beams to be transmitted        therethrough, the light beams entering a pixel in an outer end        portion of the imaging element in an effective pixel area, the        position having a width Hopt.        (10) The camera system according to (9), in which

the width Hopt of the laminated material that allows the outermost lightbeam to be transmitted therethrough is represented based on a thicknessof the laminated material, a focal length of a lens, an F-number of thelens, and an image height of an image sensor, by the following formula:Hopt=T*(f−2*H*Fno)/(2*f*Fno+H)

in which T, f, Fno, and H represent the thickness of the laminatedmaterial, the focal length of the lens, the F-number of the lens, andthe image height of the image sensor, respectively.

(11) The camera system according to (9), in which

a position of an end portion of a lower surface of the laminatedmaterial is located on a side of the effective pixel area nearer than aposition of the end portion of the upper surface thereof.

(12) The camera system according to (9), in which

the laminated material is an optical filter.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. An imaging apparatus, comprising: a lens; asubstrate; a pixel area on the substrate and configured to receiveincident light through the lens; a wiring layer including a portion thatoverlaps the pixel area in a plan view; a pad portion on the wiringlayer and electrically connected to the wiring layer; a wiringelectrically connected to the pad portion; and an optical member on thewiring layer and attached to the wiring layer via an adhesive member,wherein a first distance between an outer edge of the pixel area and anouter edge of the optical member is such that the incident light isincident to the pixel area through an upper surface of the opticalmember and such that the incident light is not incident to the pixelarea through the outer edge of the optical member.
 2. The imagingapparatus according to claim 1, wherein the first distance is largerthan a distance Hopt, wherein Hopt is represented by the followingformula:Hopt=T*(f−2*H*Fno)/(2*f*Fno+H), wherein T, f, Fno, and H represent athickness of the optical member, a focal length of the lens, an F-numberof the lens, and an image height of the pixel area, respectively.
 3. Theimaging apparatus according to claim 1, wherein the outer edge of theoptical member is between the outer edge of the pixel area and the padportion in the horizontal direction.
 4. The imaging apparatus accordingto claim 1, wherein an outer edge of the adhesive member is further awayfrom the pixel area than the outer edge of the optical member in thehorizontal direction.
 5. The imaging apparatus according to claim 1,wherein the adhesive member covers the pixel area.
 6. The imagingapparatus according to claim 1, wherein the pad portion extends throughthe wiring layer to contact an upper surface of the substrate.
 7. Theimaging apparatus according to claim 1, wherein the outer edge of theoptical member is between the outer edge of the pixel area and the padportion in the horizontal direction.
 8. The imaging apparatus accordingto claim 7, wherein an outer edge of the adhesive member is further awayfrom the pixel area than the outer edge of the optical member in thehorizontal direction.
 9. An imaging apparatus, comprising: a lens; asubstrate; a pixel area on the substrate and configured to receiveincident light through the lens; a wiring layer on the substrate andincluding a portion that overlaps the pixel area in a plan view; a padportion on the wiring layer and electrically connected to the wiringlayer; a wiring electrically connected to the pad portion; and anoptical member on the wiring layer and attached to the wiring layer viaan adhesive member, wherein a horizontal distance between an outer edgeof the pixel area and an outer edge of the optical member is such thatthe incident light is incident to the pixel area through an uppersurface of the optical member and such that the incident light is notincident to the pixel area through the outer edge of the optical member,wherein the outer edge of the optical member is an outer edge of theupper surface of the optical member, and wherein an outer edge of theadhesive member is between the outer edge of the upper surface of theoptical member and the pad portion in a horizontal direction.
 10. Theimaging apparatus according to claim 9, wherein the horizontal distanceis larger than a distance Hopt, wherein Hopt is represented by thefollowing formula:Hopt=T*(f−2*H*Fno)/(2*f*Fno+H), wherein T, f, Fno, and H represent athickness of the optical member, a focal length of the lens, an F-numberof the lens, and an image height of the pixel area, respectively. 11.The imaging apparatus according to claim 9, wherein the outer edge ofthe optical member is between the outer edge of the pixel area and thepad portion in the horizontal direction.
 12. The imaging apparatusaccording to claim 9, wherein an outer edge of the adhesive member isfurther away from the pixel area than the outer edge of the opticalmember in the horizontal direction.
 13. The imaging apparatus accordingto claim 9, wherein a second distance between the outer edge of theupper surface of the optical member and the pad portion in thehorizontal direction is less than a thickness of the optical member. 14.The imaging apparatus according to claim 9, wherein the adhesive membercovers the pixel area.
 15. The imaging apparatus according to claim 9,wherein the pad portion extends through the wiring layer to contact anupper surface of the substrate.
 16. The imaging apparatus according toclaim 9, wherein the outer edge of the optical member is between theouter edge of the pixel area and the pad portion in the horizontaldirection, and wherein an outer edge of the adhesive member is furtheraway from the pixel area than the outer edge of the optical member inthe horizontal direction.